Automatic ultrasonic cleaning machine manufacturers are also popular in the semiconductor industry!

全球半導(dǎo)體產(chǎn)業(yè)已步入成熟期。未來10年半導(dǎo)體產(chǎn)業(yè)年均增長率放緩。手機(jī)和消費(fèi)類電子產(chǎn)品將是推動(dòng)未來半導(dǎo)體產(chǎn)業(yè)增長的主動(dòng)力。未來半導(dǎo)體產(chǎn)業(yè)將是獨(dú)立半導(dǎo)體產(chǎn)業(yè)的天下。未來半導(dǎo)體產(chǎn)業(yè)的整合、兼并將越演越烈。未來半導(dǎo)體產(chǎn)業(yè)技術(shù)會越來越受到關(guān)注。例如：半導(dǎo)體產(chǎn)業(yè)的基礎(chǔ)是硅材料工業(yè)，因?yàn)楣杵砻娴奈廴疚飼?yán)重影響器件的性能、可靠性、和成品率。隨著微電子技術(shù)的飛速發(fā)展以及人們對原料要求的提高，污染物對器件的影響也愈加突出，清洗技術(shù)在半導(dǎo)體行業(yè)越來越重要。

The global semiconductor industry has entered a mature period. In the next 10 years, the average annual growth rate of semiconductor industry will slow down. Mobile phones and consumer electronics will be the driving force to promote the growth of the semiconductor industry in the future. The future semiconductor industry will be the world of independent semiconductor industry. In the future, the integration and merger of semiconductor industry will become more and more intense. In the future, more and more attention will be paid to the technology of semiconductor industry. For example, the foundation of semiconductor industry is silicon material industry, because the pollutants on the surface of silicon wafer will seriously affect the performance, reliability and yield of devices. With the rapid development of microelectronics technology and the improvement of people's requirements for raw materials, the impact of pollutants on devices is becoming more and more prominent. Cleaning technology is becoming more and more important in the semiconductor industry.
           

以前傳統(tǒng)的浸洗、刷洗、壓力沖洗、振動(dòng)清洗和蒸氣清洗，這些清洗方法都很容易破壞半導(dǎo)體表面，而且半導(dǎo)體制程中重復(fù)次數(shù)多的工序，清洗效果的好壞較大程度的影響芯片制程及積體電路特性等質(zhì)量問題。在所有的清洗方式中全自動(dòng)超聲波清洗機(jī)對半導(dǎo)體的清洗效率高、效果好的一種，之所以超聲波清洗能夠達(dá)到如此的效果是與它獨(dú)特的工作原理和清洗方法密切相關(guān)的。

In the past, traditional cleaning methods such as immersion, brushing, pressure cleaning, vibration cleaning and steam cleaning are easy to damage the semiconductor surface. Moreover, the repeated processes in the semiconductor process have a great impact on the quality of the chip process and integrated circuit characteristics. Among all the cleaning methods, the automatic ultrasonic cleaning machine has high efficiency and good effect on semiconductor cleaning. The reason why the ultrasonic cleaning can achieve such an effect is closely related to its unique working principle and cleaning method.

我們知道，半導(dǎo)體外形比較復(fù)雜，孔內(nèi)小，利用全自動(dòng)超聲波清洗機(jī)的效率高和高清潔度，得益于其聲波在介質(zhì)中傳播時(shí)產(chǎn)生的穿透性和空化沖擊疚，所以很容易將帶有復(fù)雜外形，內(nèi)腔和細(xì)空清洗干凈，在超聲波作用下只需兩三分鐘即可完成，其速度比傳統(tǒng)方法可提高幾倍，甚至幾十倍，清潔度也能達(dá)到高標(biāo)準(zhǔn)，提高了對半導(dǎo)體的生產(chǎn)效率，更突出顯示了用其他處理方法難以達(dá)到或不可取代的結(jié)果。

As we all know, the semiconductor has a complex shape and a small hole. The high efficiency and high cleanliness of the fully automatic ultrasonic cleaning machine are due to the penetrability and cavitation impact of the sound wave propagating in the medium. Therefore, it is easy to clean the cavity and fine air with complex shape. It only takes two or three minutes under the action of ultrasonic, Its speed can be several times or even dozens of times higher than that of traditional methods, and its cleanliness can also reach high standards, which improves the production efficiency of semiconductors, and highlights the results that can not be achieved or replaced by other treatment methods.